Samsung Electronics expects revenue of $100 million or more from its next batch of advanced chip-packaging products this year, co-CEO Kye-Hyun Kyung said Wednesday.
Samsung established advanced chip packaging as a business unit last year, and Kyung said he expects the results of Samsung’s investment to be evident from the second half of this year.
Kyung’s comments were made during Samsung’s annual common shareholders meeting.
Kyung said Samsung’s memory chip business wants to gain more profit share than its market share this year.
Samsung’s market share of DRAM chips used in tech devices reached 45.5% in the fourth quarter of last year, according to data provider TrendForce.
To do this, Samsung wants to secure a competitive advantage in high-end memory chips needed for the growing demand for artificial intelligence, including mass production of a 12-stack version of high-bandwidth memory (HBM) chips called HBM3E. Is.
Kyung said that for the future generation of HBM chips, called HBM4, which is likely to be released in 2025 with more optimized designs, Samsung will integrate memory chips, chip contract manufacturing and more under one roof to meet the needs of Samsung customers. Chip design will benefit businesses.
Answering a shareholder’s question on Samsung recent shock Compared with rival SK Hynix in the current HBM market, Kyung said: “We are better prepared to prevent this from happening again in the future”.
Samsung Electronics shares rose as much as 6.04% on Wednesday, and Nvidia CEO Jensen Huang said the AI ​​semiconductor leader was poised for its highest one-day jump since early September. qualifying For use with Samsung’s HBM chips.
Kyung said Samsung expects to see solid results soon from other memory products it is developing for use in AI, including Compute Express Link (CXL) and Processing-in-Memory (PIM) products.